LG Innotek has announced the development and application of the world’s first copper post (Cu-Post) technology for high-value semiconductor substrates used in mobile devices. Unlike conventional methods that use solder balls, the Cu-Post technique employs copper pillars, allowing substrate sizes to be reduced by up to 20% without compromising performance. This enables thinner, high-performance smartphones and supports advanced functions such as AI computation. Copper’s thermal conductivity, over seven times that of traditional solder, also significantly improves heat dissipation from semiconductor packages. LG Innotek aims to strengthen its leadership in the global RF-system-in-package substrate market and grow its semiconductor component business to 3 trillion won in annual revenue by 2030.

* Article source : https://www.koreaherald.com/article/10517422