At CES 2026 in Las Vegas, the spotlight was on ‘Physical AI’ semiconductors designed for humanoids and autonomous robots. SK Hynix showcased its 16-layer HBM4 for the first time, asserting leadership in next-gen memory. Meanwhile, Nvidia and AMD unveiled chipsets capable of real-time processing for complex physical calculations. This shift indicates that AI is moving beyond the virtual world into physical reality, with low-power, high-performance chip technology becoming the ultimate competitive edge.
